WDS-700 Automatic BGA Rework Station with Optical Alignment and 470 × 380 mm PCB Capacity

Description

The WDS-700 Automatic BGA Rework Station provides a controlled solution for removing, aligning and soldering compatible integrated circuits and BGA components on printed circuit boards. The machine uses three heating sections consisting of a 1,200 W upper heating system, a 1,200 W lower heating system, and a 2,700 W lower infrared heating system. Its total rated power is 5,200 W. Independent upper and lower temperature measurement allows each heating section to be controlled according to the required rework profile. A high-precision K-type thermocouple and closed-loop control system provide temperature accuracy of up to ±2°C. The PCB support uses a V-shaped positioning slot. Its adjustable bracket can be moved in the X and Y directions, while laser positioning assists with fast and accurate component alignment. The machine supports PCB sizes from 10 × 10 mm up to 470 × 380 mm and PCB thicknesses from 0.3–5 mm. It can process compatible chips measuring from 1 × 1 mm to 80 × 80 mm, with a minimum chip spacing of 0.15 mm. A high-sensitivity touchscreen, PLC, temperature-control module and stepper driver provide centralised control of the rework process. Optical magnification from 2× to 32× helps the operator inspect and align small electronic components. Specifications Specification Details Model WDS-700 Machine Type Automatic BGA rework station Total Power 5,200 W Upper Heating Power 1,200 W Lower Heating Power 1,200 W Lower Infrared Heating Power 2,700 W Controlled Lower IR Power 1,200 W Power Supply AC 220 V ±10%, 50 Hz Electrical Phase Single-phase Maximum PCB Size 470 × 380 mm Minimum PCB Size 10 × 10 mm PCB Thickness Range 0.3–5 mm Compatible Chip Size 1 × 1 mm to 80 × 80 mm Minimum Chip Spacing 0.15 mm Optical Magnification 2×–32× Temperature Accuracy Up to ±2°C Temperature Sensor High-precision K-type thermocouple Temperature Control Closed-loop independent upper and lower control Temperature-Measuring Interface 1 Positioning Method Adjustable V-shaped PCB bracket with laser positioning Control Components Touchscreen, temperature-control module, PLC and stepper driver Key Features Total heating power of 5,200 W Independent upper and lower temperature control Lower infrared heating system High-precision K-type thermocouple Closed-loop temperature regulation Temperature accuracy of up to ±2°C Supports PCBs up to 470 × 380 mm Processes chips from 1 × 1 mm to 80 × 80 mm Adjustable X- and Y-direction PCB bracket Laser-assisted positioning Optical magnification from 2× to 32× High-sensitivity touchscreen control Integrated PLC and stepper driver Suitable for automatic component rework Applications BGA chip removal and replacement Motherboard component repair PCB soldering and desoldering Laptop and computer-board repair Mobile-device motherboard repair Game-console board repair Industrial-control board servicing Electronic-component replacement Electronics repair workshops PCB production and rework facilities